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Zhongshan Investment Holdings, a Zhongshan-based state-owned enterprise, issued its first technology innovation corporate bonds for 2024 on the Shenzhen Stock Exchange on January 24.

The bonds were issued to raise a total of 500 million yuan in a period of 3+2 years, with a coupon rate of 2.67%.

Prior to this, Zhongshan Investment Holdings had issued 500 million yuan of GBA sci-tech corporate bonds on November 14, 2023.

In 2023, with the high-quality development fund of funds managed by Zhongshan Investment Holdings, a total of 23 technology innovation projects including ZEPHYRM, Chip Carrier Semiconductor, SINOTAU and others, with a total investment of exceeding 1.5 billion yuan.